Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10953487 | Ultrasonic vibration bonding apparatus | Yoshihito Yamada | 2021-03-23 |
| 10946475 | Tool for ultrasonic bonding and apparatus for ultrasonic bonding | Yoshihito Yamada | 2021-03-16 |