Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031276 | Wafer expanding method and wafer expanding apparatus | Masaru Nakamura | 2021-06-08 |
| 10994366 | Repair method and repair material | Satoshi Ishino, Kosuke Nakano, Hidekiyo Takaoka | 2021-05-04 |
| 10888961 | Joining material and method for manufacturing joined body | — | 2021-01-12 |