Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11128293 | Compensation for device property variation according to wafer location | Michael J. Krasowski, Norman F. Prokop, David J. Spry | 2021-09-21 |
| 11004802 | Reliability extreme temperature integrated circuits and method for producing the same | David J. Spry | 2021-05-11 |