Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11173645 | Apparatuses and methods for applying radius filler | Fei Cai, Weidong Song, Jamie J. Langabeer, Adam M. DeVries, Kyler J. Kamyszek | 2021-11-16 | $37,066,000 |