Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145612 | Methods for bump planarity control | — | 2021-10-12 |
| 11081456 | Textured bond pads | Aniceto Tabangcura Rabilas, Jr., Ray Fredric De Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya | 2021-08-03 |