Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088055 | Package with dies mounted on opposing surfaces of a leadframe | Noboru Nakanishi | 2021-08-10 |
| 11062980 | Integrated circuit packages with wettable flanks and methods of manufacturing the same | Daiki Komatsu | 2021-07-13 |
| 11004742 | Methods and apparatus for an improved integrated circuit package | — | 2021-05-11 |
| 10935300 | Refrigerator including a detachably mounted cooling unit | Hitoshi Takase, Shingo IMANO, Tomoharu Iwamoto, Tomohiko Matsuno, Tatsuya Seo | 2021-03-02 |