Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160163 | Electronic substrate having differential coaxial vias | Snehamay Sinha, Tapobrata Bandyopadhyay | 2021-10-26 |
| 11081472 | Stacked die multichip module package | Jonathan Almeria Noquil | 2021-08-03 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11160163 | Electronic substrate having differential coaxial vias | Snehamay Sinha, Tapobrata Bandyopadhyay | 2021-10-26 |
| 11081472 | Stacked die multichip module package | Jonathan Almeria Noquil | 2021-08-03 |