Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11167983 | Selective wafer removal process for wafer bonding applications | — | 2021-11-09 |
| 11084717 | Through-substrate conductor support | Virgil Ararao | 2021-08-10 |
| 11000915 | Stabilized transient liquid phase metal bonding material for hermetic wafer level packaging of MEMS devices | Simon Joshua Jacobs | 2021-05-11 |