Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088047 | Ceramic package opening, heat sink, vias coupled to conductive pad | Javier Antonio Valle Mayorga, Hector Torres | 2021-08-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088047 | Ceramic package opening, heat sink, vias coupled to conductive pad | Javier Antonio Valle Mayorga, Hector Torres | 2021-08-10 |