| 11205695 |
Method of fabricating a thick oxide feature on a semiconductor wafer |
Elizabeth Costner Stewart, Thomas D. Bonifield, Jay Sung Chun, Byron Lovell Williams |
2021-12-21 |
| 11087451 |
Generating multi-focal defect maps using optical tools |
Elizabeth Costner Stewart, Young Sawk Oh, Zhiyi Yu, Thomas D. Bonifield |
2021-08-10 |
| 11069627 |
Scribe seals and methods of making |
Thomas D. Bonifield, Byron Lovell Williams, Honglin Guo |
2021-07-20 |
| 11049820 |
Crack suppression structure for HV isolation component |
Elizabeth Costner Stewart |
2021-06-29 |
| 11024576 |
Semiconductor package with underfill between a sensor coil and a semiconductor die |
Byron Lovell Williams, Thomas D. Bonifield |
2021-06-01 |
| 10998278 |
Process and method for achieving high immunity to ultrafast high voltage transients across inorganic galvanic isolation barriers |
Thomas D. Bonifield, Yoshihiro Takei, Mitsuhiro Sugimoto |
2021-05-04 |
| 10978548 |
Integrated capacitor with sidewall having reduced roughness |
Elizabeth Costner Stewart, Thomas D. Bonifield, Joseph A. Gallegos, Jay Sung Chun, Zhiyi Yu |
2021-04-13 |
| 10957655 |
Integrated circuit with inductors having electrically split scribe seal |
Sreeram Subramanyam Nasum, Kumar Anurag Shrivastava |
2021-03-23 |
| 10886120 |
Hydrogen ventilation of CMOS wafers |
Adrian Salinas, Elizabeth Costner Stewart, Dhanoop Varghese, Thomas D. Bonifield |
2021-01-05 |