Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211320 | Package with shifted lead neck | Joe Ann Feive Carbonell Lopez, Gloria Bibal Manaois, Kevin John Bersamira Delos Santos | 2021-12-28 |
| 11049800 | Semiconductor device package with grooved substrate | Cherry Lyn Marquez Aranas | 2021-06-29 |
| 10991621 | Semiconductor die singulation | Connie Alagadan Esteron | 2021-04-27 |
| 10964629 | Siderail with mold compound relief | Richard Diestro Sumalinog, Ruby Ann Merto Camenforte, Sylvester Tigno Sanchez | 2021-03-30 |