Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910293 | Leadframe with die pad having cantilevers to secure electronic component | Bob Lee, YuhHarng Chien | 2021-02-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10910293 | Leadframe with die pad having cantilevers to secure electronic component | Bob Lee, YuhHarng Chien | 2021-02-02 |