Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081366 | MCM package isolation through leadframe design and package saw process | Emerson Mamaril Enipin, John Carlo Cruz Molina | 2021-08-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081366 | MCM package isolation through leadframe design and package saw process | Emerson Mamaril Enipin, John Carlo Cruz Molina | 2021-08-03 |