Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195269 | Exposed pad integrated circuit package | Reynaldo Corpuz Javier, Andy Quang Tran | 2021-12-07 |
| 10993325 | Interposer printed circuit boards for power modules | John Andrew Trelford, Richard John Yeager, Thang Danh Truong | 2021-04-27 |