Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11196234 | Solder-creep management in high-power laser devices | Parviz Tayebati, Bien Chann, Robin Huang | 2021-12-07 |
| 11143932 | Systems and methods for laser systems with variable beam parameter product utilizing thermo-optic effects | Parviz Tayebati, Francisco VILLARREAL-SAUCEDO, Bien Chann, Dat Nguyen | 2021-10-12 |
| 11095091 | Packages for high-power laser devices | Bryan Lochman, Matthew Sauter, Bien Chann | 2021-08-17 |
| 10951006 | High-power laser packaging utilizing carbon nanotubes and partially reflective output coupler | Won Tae Lee, Zhongyong Liu | 2021-03-16 |