Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121478 | Crimp contact with structured region for preventing conductor slippage during crimping | Jochen Brandt, Uwe Bluemmel | 2021-09-14 |
| 10933675 | Aluminum based solderable contact | Shallu Soneja, Gokce Gulsoy, Yiliang Wu, Xiao (Nichee) Zhou, Helge Schmidt +1 more | 2021-03-02 |