Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11124613 | Resin composition and uses of the same | Chin-Hsien Hung | 2021-09-21 |
| 11124614 | Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same | Chin-Hsien Hung, Meng-Huei Chen | 2021-09-21 |
| 11015052 | Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Chin-Hsien Hung | 2021-05-25 |