Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158591 | Bond pad structure for bonding improvement | Chia-Chan Chen | 2021-10-26 |
| 11139212 | Semiconductor arrangement and method for making | Chia-Chan Chen | 2021-10-05 |
| 11133340 | Device comprising photodiode and method of making the same | Chia-Chan Chen, Ta-Hsin Chen, Shih-Hsien Huang, Chih-Huang Li | 2021-09-28 |
| 10998359 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2021-05-04 |
| 10998360 | Image sensor with shallow trench edge doping | Chia-Chan Chen | 2021-05-04 |