Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127837 | Method of forming MOSFET structure | Ching-Feng Fu, Chih-Hsin Ko, Chun-Hung Lee, Huan-Just Lin, Hui-Cheng Chang | 2021-09-21 |
| 10998228 | Self-aligned interconnect with protection layer | Ching-Feng Fu, Chia-Ying Lee | 2021-05-04 |