Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107708 | Heating platform, thermal treatment and manufacturing method | Hsiao-Hua Peng | 2021-08-31 |
| 11062886 | Apparatus and method for controlling wafer uniformity | Hsiao-Hua Peng | 2021-07-13 |