DY

De-Wei Yu

TSMC: 4 patents #645 of 3,494Top 20%
📍 Lileng, TW: #2 of 3 inventorsTop 70%
Overall (2021): #51,271 of 548,734Top 10%
4
Patents 2021

Issued Patents 2021

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11205709 Defect filling in patterned layer Chia-Ao Chang, Chien-Hao Chen, Yung-Cheng Lu 2021-12-21
11183426 Method for forming a FinFET structure that prevents or reduces deformation of adjacent fins Yun Chen Teng, Chien-Hao Chen 2021-11-23
11114545 Cap layer and anneal for gapfill improvement Chien-Hao Chen 2021-09-07
11107903 Selective silicon growth for gapfill improvement Chien-Hao Chen, Pin-Ju Liang, I-Chen Yang 2021-08-31