Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201122 | Method of fabricating semiconductor device with reduced warpage and better trench filling performance | Yu-Chuan Hsu, Chen-Hui Yang | 2021-12-14 |
| 10923391 | Semiconductor device with contact pad | Chen-Hui Yang, Yu-Chuan Hsu | 2021-02-16 |