Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024552 | Device arrangement structure assembly having adhesive tape layer | Chun-Hao Liao, Chu Fu Chen, Mingo Liu | 2021-06-01 |
CY
Chiou Jun Yean
Overall (2021): #492,928 of 548,734Top 90%
1
Patents 2021