Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081585 | Via structure with low resistivity and method for forming the same | Kuo-Chiang Tsai, Fu-Hsiang Su, Ke-Jing Yu, Jyh-Huei Chen | 2021-08-03 |
CH
Chih-Hong Hwang
Overall (2021): #500,633 of 548,734Top 95%
1
Patents 2021