Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11038077 | Chip package and manufacturing method thereof | Yen-Shih Ho, Po-Han Lee, Yi-Rong Ho | 2021-06-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11038077 | Chip package and manufacturing method thereof | Yen-Shih Ho, Po-Han Lee, Yi-Rong Ho | 2021-06-15 |