CS

Cheng-Bo Shu

TSMC: 3 patents #860 of 3,494Top 25%
📍 Tainan, TW: #117 of 842 inventorsTop 15%
Overall (2021): #87,325 of 548,734Top 20%
3
Patents 2021

Issued Patents 2021

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11121047 Semiconductor structure Tsung-Hua Yang, Chung-Jen Huang 2021-09-14
11114452 Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technology Chung-Jen Huang, Yun-Chi Wu 2021-09-07
10937795 Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technology Chung-Jen Huang, Yun-Chi Wu 2021-03-02