Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114395 | Post passivation interconnect | Yi-An Lin, Alan KUO, Yu-Lung Shih | 2021-09-07 |
| 11018100 | Semiconductor device having a passivation layer | Yu-Lung Shih, Chao-Keng Li, Alan KUO, Yi-An Lin | 2021-05-25 |