Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11178758 | Wiring substrate and method of manufacturing the wiring substrate | Yutaka Yamazaki | 2021-11-16 |
| 11059434 | Binding member and engaging member | Toshio Iwahara, Katsuya Hirakawa | 2021-07-13 |
| 11052838 | Engaging member | Toshio Iwahara, Katsuya Hirakawa | 2021-07-06 |
| 11040882 | Carbon material precursor, carbon material precursor composition containing the same, and method for producing carbon material using these | Takuya Morishita, Kazuhiro Nomura, Hiromitsu Tanaka, Megumi Sasaki | 2021-06-22 |
| 11007702 | Resin member and wearable band | Hiroaki Hosomi | 2021-05-18 |
| 10995245 | Epoxy resin composition and electro-conductive adhesive containing the same | Soichi Ota, Takashi Suzuki, Hitoshi Mafune, Masayuki Osada | 2021-05-04 |
| 10982120 | Thermocurable electroconductive adhesive | Soichi Ota, Hitoshi Mafune, Tomoya Kodama | 2021-04-20 |
| 10981522 | Binding structure of wire routing material | Katsuya Hirakawa, Kazunori Takata, Shinji Oshita, Itsuo WAKABAYASHI | 2021-04-20 |
| D908075 | Instrument panel for an automobile | Aaron Park, Akihisa Okada, Takeshi Okabe, Isamu Masakawa | 2021-01-19 |