Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923362 | Manufacturing process of element chip | Atsushi Harikai, Noriyuki Matsubara, Shogo Okita | 2021-02-16 |
| 10896849 | Method of dicing a semiconductor wafer using a protective film formed by coating a mixture of water-soluble resin and organic solvent | Shogo Okita, Noriyuki Matsubara, Hidefumi SAEKI | 2021-01-19 |