Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174402 | Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded interconnect device | — | 2021-11-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174402 | Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded interconnect device | — | 2021-11-16 |