Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158556 | Electronic chip package having a support and a conductive layer on the support | Romain Jaillet | 2021-10-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158556 | Electronic chip package having a support and a conductive layer on the support | Romain Jaillet | 2021-10-26 |