Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063027 | Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die | Davide Giuseppe Patti | 2021-07-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063027 | Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die | Davide Giuseppe Patti | 2021-07-13 |