Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892291 | Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection | Sonarith Chhun | 2021-01-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892291 | Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection | Sonarith Chhun | 2021-01-12 |