Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903183 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | HeeJo Chi, HanGil Shin | 2021-01-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903183 | Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die | HeeJo Chi, HanGil Shin | 2021-01-26 |