Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10882967 | Method for preparing polyimide film having low dielectric constant and high fracture toughness | Jianqing ZHAO, Shumei LIU, Sen Zhang | 2021-01-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10882967 | Method for preparing polyimide film having low dielectric constant and high fracture toughness | Jianqing ZHAO, Shumei LIU, Sen Zhang | 2021-01-05 |