Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183472 | Semiconductor device and manufacturing method of semiconductor device for improving solder connection strength | — | 2021-11-23 |
| 10930695 | Semiconductor device and method of manufacturing the same | Satoru Wakiyama, Kan Shimizu, Toshihiko Hayashi, Naoki JYO | 2021-02-23 |