Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133343 | Imaging device and electronic device configured by bonding a plurality of semiconductor substrates including a first multilayer having a first vertical signal line formed in a differrent layer than the layer of a first wiring of a first connection region | Hajime Yamagishi, Yuusaku KOBAYASHI | 2021-09-28 |