Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11027458 | Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg | Hiroyuki Fujisawa, Yoshihiko Nakamura | 2021-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11027458 | Prepreg, metal-clad laminate, printed wiring board, and method for producing prepreg | Hiroyuki Fujisawa, Yoshihiko Nakamura | 2021-06-08 |