Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209799 | Method for inserting a wire into a groove of a semiconductor chip | Robin Lethiecq, Pavina Nguyen, Christopher Mackanic | 2021-12-28 |
| 11081466 | Method for joining a micorelectronic chip to a wire element | Delphine Rolland, Christopher Mackanic, Gianfranco Andia Vera | 2021-08-03 |