Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10911020 | Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer | — | 2021-02-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10911020 | Method of providing protective cavity and integrated passive components in wafer level chip scale package using a carrier wafer | — | 2021-02-02 |