Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205638 | Stack packages including an interconnection structure | — | 2021-12-21 |
| 11201140 | Semiconductor packages including stacked sub-packages with interposing bridges | — | 2021-12-14 |
| 11127687 | Semiconductor packages including modules stacked with interposing bridges | — | 2021-09-21 |
| 11127722 | Stack packages including vertically stacked sub-packages with interposer bridges | — | 2021-09-21 |
| 11114362 | Stacked semiconductor package having heat dissipation structure | Jong Hoon Kim, Ki Bum Kim | 2021-09-07 |
| 11018094 | Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages | Ki-Yong Lee, Se Jin Park, Hyoung Min IM | 2021-05-25 |
| 10991640 | Semiconductor packages including bridge die | Jong Hoon Kim, Ki Bum Kim | 2021-04-27 |
| 10957627 | Semiconductor packages including a bridge die | — | 2021-03-23 |
| 10923434 | Semiconductor packages having EMI shielding layers | Juil Eom, Sang Joon LIM | 2021-02-16 |