Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056442 | Substrate structure, electronic package having the same, and method for fabricating the same | Po-Hao Wang, Chun-Tang Lin, Yu-Hsiang Hsieh | 2021-07-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056442 | Substrate structure, electronic package having the same, and method for fabricating the same | Po-Hao Wang, Chun-Tang Lin, Yu-Hsiang Hsieh | 2021-07-06 |