Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152331 | Electronic package and method for fabricating the same | Lung-Yuan Wang, Feng Kao | 2021-10-19 |
| 11081415 | Method for manufacturing electronic package | Chieh-Lung Lai, Cheng-Yi Chen, Chun-Hung Lu | 2021-08-03 |