Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101235 | Fabrication method of semiconductor package with stacked semiconductor chips | — | 2021-08-24 |
| 10950507 | Electrical testing method of interposer | Chi-Hsin Chiu, Shih-Kuang Chiu | 2021-03-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101235 | Fabrication method of semiconductor package with stacked semiconductor chips | — | 2021-08-24 |
| 10950507 | Electrical testing method of interposer | Chi-Hsin Chiu, Shih-Kuang Chiu | 2021-03-16 |