Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903167 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hong-Da Chang | 2021-01-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10903167 | Electronic package, packaging substrate, and methods for fabricating the same | Jun Ding, Hong-Da Chang | 2021-01-26 |