Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205644 | Method for fabricating electronic package | Chi-Rui Wu, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai | 2021-12-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205644 | Method for fabricating electronic package | Chi-Rui Wu, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai | 2021-12-21 |