Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171072 | Heat dissipation substrate and manufacturing method thereof | Bo Huang, Chia-Wei Chang, Tzu-Shih Shen | 2021-11-09 |
| 10957614 | Heat dissipation substrate and fabricating method thereof | Tzu-Shih Shen | 2021-03-23 |