Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11034868 | Hot-melt pressure sensitive adhesive composition having improved rheological properties | Juan Ramón Vila Ferreira, Thomas HANHÖRSTER | 2021-06-15 |
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2021", "item": "https://www.patentleaderboard.com/2021/"}, {"@type": "ListItem", "position": 3, "name": "Sika Technology Ag", "item": "https://www.patentleaderboard.com/2021/company/sika-technology-ag"}, {"@type": "ListItem", "position": 4, "name": "Daniel Ueding", "item": "https://www.patentleaderboard.com/2021/inventor/fl:da_ln:ueding-1"}]}
Skip to contentShowing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11034868 | Hot-melt pressure sensitive adhesive composition having improved rheological properties | Juan Ramón Vila Ferreira, Thomas HANHÖRSTER | 2021-06-15 |