Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011457 | Wiring substrate | Koichi Nishimura, Jun Furuichi | 2021-05-18 |
| 10993322 | Circuit board, laminated circuit board, and method of manufacturing circuit board | Keigo Sato, Hiroshi Taneda | 2021-04-27 |
| 10978383 | Wiring board and method of manufacturing the same | Wataru Kaneda, Akio Rokugawa | 2021-04-13 |