Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152293 | Wiring board having two insulating films and hole penetrating therethrough | Kazuhiro Oshima, Hiroharu Yanagisawa, Kazuhiro Kobayashi, Ken Miyairi | 2021-10-19 |
| 10892217 | Wiring substrate and semiconductor device | Takashi Arai, Fumimasa Katagiri | 2021-01-12 |